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Photonic Chip Packaging: Mitigating Waveguide Loss at the Fiber-to-Chip Interface in Smart Home Sensors

光子芯片封装：在智能家居传感器的光纤-芯片接口处抑制波导损耗

Photonic Chip Packaging: Mitigating Waveguide Loss at the Fiber-to-Chip Interface in Smart Home Sensors

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  1. Waveguide loss at fiber-to-chip interfaces accounts for over 68% of total optical budget depletion in edge-deployed environmental sensors.

  2. Precision alignment tolerances fall below ±0.3 μm—demanding active photonic packaging rather than passive solder-reflow techniques used in legacy electronics.

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