How Batch-0042-009 Quantifies the Role of Nonlinear Thermal Expansion Mismatch in High-Power LED Package Delamination Failure

批次0042-009如何量化非线性热膨胀失配在高功率LED封装脱层失效中的作用

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Delamination at copper–ceramic interfaces in high-power LED packages arises primarily from accumulated strain due to nonlinear CTE divergence above 120°C.
X-ray computed tomography combined with digital image correlation reveals microvoid nucleation precisely at curvature maxima in solder interlayers.

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